Engineering considerations in multi-chiplet designs.
Through-silicon vias (TSVs) provide essential interconnects between DRAM dies inside high-bandwidth memory stacks, silicon ...
Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs.
When Finland’s Donut Lab claimed earlier this year that it had developed a solid-state battery capable of storing 400 ...
Researchers at the University of California San Diego and Rutgers University created a brain-inspired device combining memory ...
AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...
Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.
Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...
Leveraging patterns in formal verification to reach sign-off faster.
Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.
A new technical paper, “Photonic chip packaging for extreme environments” was published by NIST, Johns Hopkins and University ...
Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.
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