Rambus announces SOCAMM2, a new chipset enabling low power, high performance LPDDR5X-based memory modules for next gen AI ...

A new AI module runs generative models locally, reducing power use and cloud reliance while handling complex workloads with ...

Rambus has launched a SOCAMM2 chipset designed to support power‑efficient, high‑performance LPDDR5X memory modules in AI ...

Investing.com -- Rambus Inc. (NASDAQ:RMBS) announced Wednesday a SOCAMM2 chipset designed to enable low-power, high-performance LPDDR5X-based memory modules for AI server platforms.

SK hynix said Monday it has begun mass production of its 192GB small outline compression attached memory module 2 (SOCAMM2), ...

QSiC Dual3 1200-V half-bridge MOSFET modules from SemiQ address the efficiency and thermal demands of liquid-cooled AI data centers. Two of the series’ six devices offer an R DS(on) of just 1 mΩ and ...

SK hynix said Monday it has begun mass production of a next-generation memory module designed for AI servers, as it seeks to ...

SK hynix Inc. (or "the company", announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10 ...

The South Korean chipmaker commenced commercial manufacturing of its high-capacity SOCAMM2 modules designed for artificial intelligence computing infrastructure.

The SK hynix logo and a computer motherboard appear in this illustration taken August 25, 2025. REUTERS/Dado ...

Pages Latest Report] According to a market research study published by Custom Market Insights, the demand analysis of Global ...

SEOUL, April 20 (Yonhap) -- SK hynix Inc. said Monday it has begun mass production of a next-generation memory module ...