Microchip Technology introduced its BZPACK mSiC power module family at the recent APEC 2026. The series was designed to meet ...

SiC and GaN device makers are using advanced junction structures and innovative packaging to offer more robust, cooler-running products. Advanced packaging technologies are also fueling the rise of ...

Bosch has announced its 3rd generation SiC MOSFETs, based on the company's dual-channel trench SiC architecture with lower on ...

ROHM Semiconductor today announced it has developed the latest device of its EcoSiC™ series: the 5 th Generation SiC MOSFETs optimized for high‑efficiency power applications. This technology is ...

The annual Applied Power Electronics Conference & Exposition (APEC 2026) showcases hundreds of companies that exhibit their latest component and technology advances for system power designers across a ...

Power electronics in the Industry 4.0 era are evolving to deliver higher efficiency and power density and simplify power design.

SiC chips reduce power loss, handle heat, & improve efficiency in EVs, data centers, and industrial systems, helping manage ...

ROHM has announced the development of its fifth-generation silicon carbide (SiC) MOSFETs, reporting a significant reduction ...

Rohm has developed the latest device of its EcoSiC series: the 5th Generation SiC MOSFETs optimised for high-efficiency power ...

Pages Latest Report] According to a market research study published by Custom Market Insights, the demand analysis of Global ...

What if you'd invested in ON Semiconductor Corp. (ON) ten years ago? It may not have been easy to hold on to ON for all that time, but if you did, how much would your investment be worth today? With ...

EV stocks are getting another look, but the shift is that it is no longer just about betting on which automaker sells the ...