Note that the kernel modules built here must be used with GSP firmware and user-space NVIDIA GPU driver components from a corresponding 595.58.03 driver release. This can be achieved by installing the ...
Abstract: Silicon carbide (SiC) power modules with Ag sinter-bonding die attach were designed on the basis of thermal stress analysis for reliable high-temperature operations. Both the finite-element ...
Abstract: In this work, trench first process integration scheme was used to develop MEMS contact module, and local surface planarization was realized by the optimized design and process control. Thin ...
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